| Kester Liquid Fluxes |
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| No-Clean Liquid Fluxes | ||||||
| Alcohol Based | VOC-Free | |||||
| Formula | ||||||
| Flux Type | Low Solids, No-Clean |
Low Solids, No-Clean |
No-Clean | Rosin Free Low Solids, No-Clean |
VOC-Free No-Clean |
VOC-Free No-Clean |
| Lead-Free Compatible | Yes | Yes | Yes | No | Yes | Yes |
| Products Characteristics | Designed for lead-free wave soldering. Developed to minimized the formation of micro-solder balls during wave soldering operations. Compatible with spray and foam applications. | Formulated for wave soldering of conventional and surface mount circuit board assemblies. Developed to minimized the formation of micro-solder balls during wave soldering operations. Designed with spray and foam applications. | 985M is specially designed to improve effectiveness in the wave soldering of conventional circuit board assemblies. Was developed for excellent solderability and through-hole fill in lead-free wave soldering process. 985M minimized micro-solderballing at connectors and CPU. Its residue left behind is non-tacky, non-corrosive and non-conductive. | Developed for single wave soldering only, 951 is extremely low solid content and minimized solder bridges (shorts) and excessive solder defects. Designed for foam or spray applications. | Most active VOC-Free flux for optimal top-side wetting and solderballs reduction. May be applied by spray or dip process. Kester 979 is also designed for lead-free application. | Developed to reduce bottom side micro-solderingballing and survive SMT dual wave soldering systems. May be applied by spray or wave. |
| Water-Soluble Liquid Flux | ||||
| Alcohol Based | VOC-Free | |||
| Formula | 2224-25 | 2120 | 2220VF | |
| Flux Type | Neutral pH Organic Water-Soluble |
Organic Water-Soluble | Organic Halide-Free | Organic Water-Soluble |
| Lead-Free Compatible | Yes | In some applications | Yes | Yes |
| Products Characteristics | Original pH neutral organic flux for automated wave and drag soldering processes. | Highly active organic flux designed for automated wave soldering applications. | Low solids flux for surface mount assemblies. Provides optimal board cleanliness. | A high activity organic flux that provides maximum capillary wetting action up plated through-holes, making it ideal for use on multi-layer boards. Minimizes icicling and bridging and produces bright, shiny solder joints. It is chemically compatible with most solder masks and board laminates and does not emit offensive odors during soldering. Suitable for spray, dip or foam applications. |
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| Rosin Based Liquid Fluxes | ||||
| Formula | 145 | 186 Series | 182 | |
| Flux Type | Rosin Non-Activated | Rosin Mildly Activated | Rosin Mildly Activated | Rosin Activated |
| Lead-Free Compatible | N/A | Yes | N/A | Yes |
| Products Characteristics | Excellent for soderability test procedures specified by military and commercial industries. | Designed for high thermal stability and superior solderability. Kester 186 is available in 18, 25, or 36 percent solids formulations. | IPC designated formulation for solderability testing. | Kester's active, non-corrosive rosin type flux. It is used on surfaces which are more difficult to solder. |
| Flux Residue Remover | |||
| Formula | 5768 Bio-Kleen® | 5252 | 5252M |
| Flux Type | Aqueous Saponifier | Halogen-Free Stencil Cleaner | Halogen-Free Solvent |
| Lead-Free Compatible | N/A | N/A | N/A |
| Products Characteristics | Rosin residues can be easily removed in an aqueous solution through saponification. Designed for difficult to remove solder paste residues. It is non-reactive with most metals present on electronic assemblies. | Multi-purpose ozone depletion potential free solvent cleaner developed for the cleaning of stencil, misprinted circuit board and mechanical devices. | Not ozone depleting. Suitable substitute for chlorinated solvents. Fast air drying, non-ionic, non-corrosive and non-carcinogenic. |
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| Component Lead Tinning Fluxes | |||
| Formula | 1429 | 2166-BN | 2169 |
| Flux Type | Halide Activated | Halide-Free | Halide-Free |
| Lead-Free Compatible | No | No | No |
| Products Characteristics | Halide activated, water based and self neutralizing flux originally developed by the Battelle Institute. | Highly active, water-based flux designed for wave soldering and dipping applications for semiconductor component lead tinning. | These active formulations are designed for high-speed wave soldering applications. Varied solids content and halide activity available. |
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